High Stability 1070nm High Precision Laser Cutting Machine , Silicon Wafer Cutter

 

Sapphire is the most hard material after the diamond, sapphire easy to break and collapse, and it’s quite difficult for this material in the elaborate processing. Herolaser specialized in the development of micro processing technology for many years, which has accumulated rich experience on sapphire cutting punch.Sub-nanosecond long pulse sapphire laser precision cutting machine,is developed of aiming at the need of sapphire material industry application. This equipment has the advantages of high cutting speed, high precision, no need to replace the consumables, complete functions, simple operation, continuous work under the conditions of various performance indicators are stable and reliable.This equipment has tested in Sapphire cutting punch field,and achieved enough affirmation and agreement from consumers.

 

 

 

 

1. No micro-cracks, broken or debris after processing ;

2. Super highly crack resistance of edge and maintaining optical performance after processing;

3. No consumable parts, no washing, grinding and polishing after cutting ,highly reduced production costs;

4. Suitable for thinner and lighter materials ,also good for irregular holes processing ;

5. Higher speed and accuracy than traditional processing, best choice for mass production.

 

 

1mm Sapphire Cutting	Picosecond laser	CNC machine	Fiber laser cutting
Φ10mm hole	180 pieces / hour 20 s / piece	100 pieces / hour 36 s / piece	720 pieces / hour 5 s / piece
Processing Efficiency	Low	Lower	High
Operational Difficulty	Very Hard	Hard	Easy
Investment	Higher	Low	High
Consumable parts	Yes	Yes	No

 

 

Mainly used in electronics industry of sapphire windows materials, all kinds of hard and brittle materials of precision cutting and punching;also can be used in thin walled high-reflective metal cutting and non-metal material marking, etching processing, such as hardware, ceramics, electronic devices, all kinds of instruments and plastic, etc.