• Shenzhen Herolaser Equipment Co., Ltd.
    Christopher Rodriguez
    We were always looking for the right technology to modify our industrial cleaning. In our search, we found Herolaser. The results and time to complete the cleaning exceeded our expectations. We now have found the right partner to make cleaning easy and without damage to the substrate.
  • Shenzhen Herolaser Equipment Co., Ltd.
    Cesare Duminuco
    Actually we were not sure about the capacity and performance of laser welding since we had always been doing MIG and TIG in our workshop. We placed the first order after more than 3-month negotiation with Herolaser. Right now the machine is working pretty well with problems solved through online communication and videos guidance.
  • Shenzhen Herolaser Equipment Co., Ltd.
    James Adams
    Nice company to cooperate with, from the planning stage to project completion. Quick response to any pre-sales and after-sales questions. We are very satisfied with the supplied quality.
Contact Person : Jack Zhang
Phone Number : 0086 134 8082 6552
Whatsapp : +8613480826552

High Stability 1070nm High Precision Laser Cutting Machine , Silicon Wafer Cutter

Place of Origin China
Brand Name Herolaser
Certification CE, FDA
Model Number ML-CT-A01
Minimum Order Quantity 1 SET
Price Negotiable
Packaging Details Wooden case package: 1700 ×1250 ×1750 mm/1500 KG
Delivery Time 20 days
Payment Terms T/T, Western Union
Supply Ability 200 sets/month

Contact me for free samples and coupons.

Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

If you have any concern, we provide 24-hour online help.

Product Details
Laser Wevelength 1070±10 Nm Laser Imported Single Mode Laser
Size Of Marble Plane 1700×1250×100 Mm Motion System Anchuan Servo Motor, HIWIN Screw Guide
Positioning Accuracy 0.03mm Repeated Positioning Accuracy ±0.01 Mm
Control System Motion DSP CNC Software PLC Mitsubishi
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Silicon Wafer 1070nm High Precision Laser Cutting Machine


1070nm High Precision Laser Cutting Machine


1070nm Silicon Wafer Cutter

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Product Description

Silicon Wafer Cutter High-speed High Precision Laser Cutting Machine for Sapphire Cutting


Model introduction:
Sapphire is the most hard material after the diamond, sapphire easy to break and collapse, and it’s quite difficult for this material in the elaborate processing. Herolaser specialized in the development of micro processing technology for many years, which has accumulated rich experience on sapphire cutting punch.Sub-nanosecond long pulse sapphire laser precision cutting machine,is developed of aiming at the need of sapphire material industry application. This equipment has the advantages of high cutting speed, high precision, no need to replace the consumables, complete functions, simple operation, continuous work under the conditions of various performance indicators are stable and reliable.This equipment has tested in Sapphire cutting punch field,and achieved enough affirmation and agreement from consumers.
Model features:
  1. The appearance of integrated design with our patent, compact and reliable structure; full closed constant temperature design, using the optical marble platform, high stability.
  2. No need to adjust the light path,it can be external trigger and easy to integrate.
  3. Non-contact processing,cutting edge smooth without collapse,high yield.
  4. Optional servo motor or linear motor, high precision CCD automatic positioning, full closed-loop feedback, high precision, fast speed, processing speed 10 times than traditional tools.
  5. It can be equipped with all kinds of fixtures and dust extraction device for hard and brittle materials.
Advantages of New Technology:
1. No micro-cracks, broken or debris after processing ;
2. Super highly crack resistance of edge and maintaining optical performance after processing;
3. No consumable parts, no washing, grinding and polishing after cutting ,highly reduced production costs;
4. Suitable for thinner and lighter materials ,also good for irregular holes processing ;
5. Higher speed and accuracy than traditional processing, best choice for mass production.
Comparison table with other processing methods​:
1mm Sapphire Cutting

Picosecond laser

CNC machine

Fiber laser cutting

Φ10mm hole

180 pieces / hour 20 s / piece 100 pieces / hour 36 s / piece 720 pieces / hour 5 s / piece
Processing Efficiency




Operational Difficulty

Very Hard







Consumable parts




Applied range:
Mainly used in electronics industry of sapphire windows materials, all kinds of hard and brittle materials of precision cutting and punching;also can be used in thin walled high-reflective metal cutting and non-metal material marking, etching processing, such as hardware, ceramics, electronic devices, all kinds of instruments and plastic, etc.
Samples for reference:
High Stability 1070nm High Precision Laser Cutting Machine , Silicon Wafer Cutter 0
1. How is the payment?
  • 30% deposit before production and the balance 70% before shipment
2. How is the delivery and shipment?
  • Ship in 7 days after 100% payment;
  • Plywood box packaging
3. How will you guarantee aftersales services?
  • We offer two warranty for laser source, one year for whole machine and lifetime maintenance services.
  • Engineers available to service machinery overseas
  • Free technical training in our factory
  • Free sample can be sent to you
  • Professional technical team 24 hours online
4. How about your presales service?
  • Speeding offer within 8 hours quick response and free consulting.
  • Free sample cutting or testing is available
  • Progressing solution design to all clients, including distributors and end users.


High Stability 1070nm High Precision Laser Cutting Machine , Silicon Wafer Cutter 1