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Christopher RodriguezWe were always looking for the right technology to modify our industrial cleaning. In our search, we found Herolaser. The results and time to complete the cleaning exceeded our expectations. We now have found the right partner to make cleaning easy and without damage to the substrate. -
Cesare DuminucoActually we were not sure about the capacity and performance of laser welding since we had always been doing MIG and TIG in our workshop. We placed the first order after more than 3-month negotiation with Herolaser. Right now the machine is working pretty well with problems solved through online communication and videos guidance.
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James AdamsNice company to cooperate with, from the planning stage to project completion. Quick response to any pre-sales and after-sales questions. We are very satisfied with the supplied quality.
355mm Picosecond UV Laser Cutting Machine High Precision 3kw
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xProduct Details
| Laser Type | 355mm Picosecond UV Laser | Working Range | 400*600mm (customizable) |
|---|---|---|---|
| Focusing Spot | 5um (depending On The Material) | Minimum Tangent Width | <10um (depending On The Material) |
| Thickness Of Processed Products | ≤ 1.5mm (depending On The Material) | Positioning Accuracy Of Workbench | ± 3um |
| Table Repetition Accuracy | ± 1um | Processing Range | 40*40mm/15*15mm (customizable) |
| Cooling System | Water Cooling | Overall Power | ≤ 3kw |
| Highlight | Picosecond UV Laser Cutting Machine,3kw UV Laser Cutting Machine,Picosecond High Precision Laser Cutting Machine |
||
Product Description
HEROLASER Picosecond UV Laser Cutting Machine
Model Profile
Picosecond laser cutting machine is applicable to ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum) Cutting, drilling and surface microstructure (texture) of flexible materials (PPC Teflon, electromagnetic film, adhesive film), graphene, carbon fiber, silicon wafer, ceramics, FPC and other materials Scribing, grooving, and micromachining of polymer materials and composites. The equipment has a wide range of uses and applicability. It can realize various treatments, customize the control depth and width, and realize the functions of stripping, etching, marking, grooving, punching, cutting, etc. on the surface of materials.
Model Features
1.Excellent beam quality, good long-term stability, negligible thermal effect.
2. The independently developed software control system can customize and upgrade various functions according to customer requirements.
3. CCD visual pre scanning & automatic target grasping and positioning processing, automatic processing of imported drawings, simple and fast operation.
4. With higher single pulse energy and higher machining accuracy, it can realize fine machining for almost any solid material.
5. It adopts picosecond ultraviolet laser and ultra short pulse ultraviolet cold laser processing,
6. No heat conduction, suitable for high-speed cutting, etching, grooving and punching of any organic-inorganic materials, with a minimum of 3 μ M and heat affected zone.
Product Advantages
1. CCD visual pre scanning & automatic target grasping and positioning, XY platform accuracy ≤± 3 μ m；
2. Precision mechanical structure, imported optical components, which can realize high stability and high precision processing;
3. The machine adopts the marble structure with strong anti-seismic performance to ensure the machine performance and overall processing accuracy;
4. Support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, and image feature points;
5. Adopted picosecond laser, ultra short pulse processing, no heat conduction, used for cutting any organic / inorganic materials.
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